iNEMI Hosts Two Sessions at IPC APEX EXPO, Focus on Roadmap for PCB, Assembly, and Laminates :: I-Connect007

In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.

We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.

In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...

Estimated reading time: 1 minute

The International Electronics Manufacturing Initiative (INEMI) will have two forward-looking sessions at the upcoming IPC APEX EXPO in Anaheim, California (March 18-20). Both sessions are open to conference attendees with a (free) Event Essentials Pass. The two sessions are outlined below.

For INEMI planning purposes, please click here to let us know if you plan to attend one or both sessions, or if you want to meet with INEMI staff at the conference.

INEMI Roadmap Readout and Future Planning Session — PCB and Laminates(Tuesday, March 18 / 9:30 a.m. — 12:00 p.m.)

This session combines information about key technology trends and associated challenges identified in the iNEMI PCB Roadmap with updates from ongoing iNEMI technical projects addressing some of these challenges. It will also include a discussion of longer-term trends and application-specific requirements anticipated over the next 10 years. The session aims to help prioritize the topics to be included in future iNEMI Roadmap updates and potentially identify topics for future collaborative projects.

INEMI Roadmap Readout and Future Planning Session — Board Assembly(Wednesday, March 19 / 8:00-10:00 a.m.)

Board assembly is a key step in the manufacture of complex integrated electronic systems. In this session, iNEMI will provide a review of the recently published Board Assembly Roadmap. There will also be a discussion of, and brainstorming on, longer-term trends and technology disruptions in board assembly and associated complex integrated systems. Outputs will be used to shape further iNEMI roadmapping activities in 2025.

In addition to the two sessions, three INEMI project teams are scheduled to present papers as part of the APEX Technical Conference:

“IPC APEX EXPO is an excellent venue where we can share roadmap and project information, get excellent industry perspectives and feedback for planning future activities, and meet with current and prospective members,” says INEMI CEO Shekhar Chandrashekhar. “We are looking forward to a very productive conference.”