1.0tc Al Ccl Aluminum Copper Clad Laminate Sheet for LED PCB
Aluminum Copper Clad Laminate Sheet This kind of copper clad laminate is made of copper clad and aluminium plate by spec
Description
Basic Info
Model NO. | AL base |
Structure | Single-Sided Rigid PCB |
Dielectric | Rcc |
Material | Aluminum Base |
Application | Consumer Electronics |
Flame Retardant Properties | V0 |
Processing Technology | Electrolytic Foil |
Production Process | Additive Process |
Base Material | Aluminum |
Insulation Materials | Rcc |
Brand | Hjh |
Sheet Thickness | 0.6-2.0mm |
Copper Thickness | 15um, 18um, 25um, 35um, 70um, Others |
Protective Film Color | Green |
Thermal Conductivity | 0.6~2.0W |
Aluminum Base Material | 1060 / 5052 |
Tg (DSC) | >130 Degree |
Breakdown Voltage | AC>/=5kv |
Transport Package | Pallet |
Specification | 1000*1200MM, 500*600MM, others |
Trademark | HJH |
Origin | China |
HS Code | 7410211000 |
Production Capacity | 200000 Sheets Per Month |
Product Description
Aluminum Copper Clad Laminate SheetThis kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.
Properties
High mechanical strength and dimensional stability,
Excellent heating radiating,
Good electric magnetic shield,
Easy machinery cutting
Applications
Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.
Specifications
AL base materials: 1060, 5052Sheet Thickness: 0.6~2.0mmCopper thickness: 15um, 18um, 25um, 35um, 70um, othersUsual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mmThermal conductivity: 0.6W/m.K, 0.8W/m.K, 1.0W/m.K, 1.5W/m.K, 2.0W/m.KProtective film: blue film (80ºC), green film (160ºC)
Main Technical Characteristics
Items | Unit | Test condition | Typical values | ||
AF-01 | AF-04 | AF-05 | |||
Peel strength | N/mm | At normal: A | 2.00 | 1.05 | 1.08 |
After thermal stress | 1.80 | 1.05 | 1.05 | ||
Surface resistance | MΩ | At normal | 5.0 x 107 | 5.0 x 107 | 3.6 x 107 |
Constant humidity treatment | 2.0 x 106 | 4.5 x 106 | 3.3 x 106 | ||
Volume resistance | MΩ·m | At normal | 4.0 x 108 | 1.0 x 108 | 4.2 x 108 |
Constant humidity treatment | 5.0 x 107 | 1.9 x 107 | 3.1 x 107 | ||
Thermal resistance | ºC/w | At normal | 1.0 | 0.65 | 0.45 |
Dielectric Constant @ 1 MHz | -- | 40ºC, 93%, 96h | 4.2 | 4.2 | 4.2 |
Dielectric dissipation factor @1 MHz | -- | 40ºC, 93%, 96h | 0.02 | 0.029 | 0.033 |
Thermal stress | min | 260ºC | 2 min, no delamination, no air bulb | ||
Dielectric breakdown | KV/MM | At normal | 31 | 31 | 60 |
Flammability | -- | At normal | FV-0 | ||
Thermal-conductive factor | W/m·k | At normal | 1.0 | 1.5 | 2.2 |
Our Contact
Send now