4L Multilayer Aluminum/ Mc PCB for Consumer and Power Electronics
Ucreate LTD PCB's aim: Customer Satisfaction is Always Our First Priority! * Quality Policy *Top Quality and high effici
Description
Basic Info
Model NO. | UCAA-20160330-13 |
Type | Rigid Circuit Board |
Dielectric | AIN |
Material | Aluminum Covered Copper Foil Layer |
Application | Consumer Electronics |
Flame Retardant Properties | V0 |
Mechanical Rigid | Rigid |
Processing Technology | Electrolytic Foil |
Base Material | Aluminum |
Insulation Materials | Epoxy Resin |
Board Layer | 4 Layers |
Finished Copper | All 1 Oz |
Board Thickness | 1.6mm |
Thickness Material | Aluminum |
Surface Finish | Enig 2u" |
Soldermask Color | Green |
PCB Testing | E-Testing, Flying Probe Testing |
Ipc Standards | Ipc Class II |
Lead Time | 6 Working Days |
Fast Turn | 2 Working Days |
Transport Package | Vacuum Package |
Specification | UL(US&Canada). ISO9001. RoHs, TS, SGS |
Trademark | UC |
Origin | Shenzhen, China |
HS Code | 8534009000 |
Production Capacity | 30000sq. M/Month |
Product Description
Ucreate LTD PCB's aim:Customer Satisfaction is Always Our First Priority!
*Quality Policy
*Top Quality and high efficiency
*Improve continuously
*Achieve customer's satisfaction
1.Products Application
2. Market Distribution
3.Technical Capabilities
Items | Speci. | Remark | |
Max panel size | 32" x 20.5"(800mm x 520mm) | ||
Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
Inner copper thickness | 1~4 oz | ||
Outer copper thickness | 0.5~6 oz | ||
Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
±10% | ±10% | 6~8 L | |
±10% | ±10% | ≥10 L | |
Inner layer treatment | brown oxidation | ||
Layer count Capability | 1-30 LAYER | ||
alignment between ML | ±2mil | ||
Min drilling | 0.15 mm | ||
Min finished hole | 0.1 mm | ||
Hole precision | ±2 mil(±50 um) | ||
tolerance for Slot | ±3 mil(±75 um) | ||
tolerance for PTH | ±3 mil(±75um) | ||
tolerance for NPTH | ±2mil(±50um) | ||
Max Aspect Ratio for PTH | 8:1 | ||
Hole wall copper thickness | 15-50um | ||
Alignment of outer layers | 4mil/4mil | ||
Min trace width/space for outer layer | 4mil/4mil | ||
Tolerance of Etching | +/-10% | ||
Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
at trace corner | ≥0.2mil(5um) | ||
On base material | ≤+1.2mil Finished thickness | ||
Hardness of solder mask | 6H | ||
Alignment of solder mask film | ±2mil(+/-50um) | ||
Min width of solder mask bridge | 4mil(100um) | ||
Max hole with solder plug | 0.5mm | ||
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
Max Nickel thickness for Gold finger | 280u"(7um) | ||
Max gold thickness for Gold finger | 30u"(0.75um) | ||
Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
bow and twist | 0.75% |
4.Products Equipment
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