UL Immersion Gold FPCB Printed Circuit Board Enig PCB

Basic Info

Model NO.	UC-32574
Processing Technology	Electrolytic Foil
Base Material	Copper
Insulation Materials	Organic Resin
Brand	Uc
Board Layer	1-24 Layer
Base Material Type	Fr4
Surface Treatment	Immersion Gold/HASL Lead Free/OPS/ Immersion Silve
Material Finished Thickness	1.6mm
Solder Mask Color	Green/White/Black/Blue/Red
Lead Time	7 Working Days
Certificate	UL(Us&Canada). ISO9001. RoHS, Ts, SGS
Transport Package	Vacuum Package
Specification	IPC class II
Trademark	UC
Origin	Shenzhen, China
HS Code	8534009000
Production Capacity	20000 Sqm/Month

Product Description

Top Quality Enig 12L PCB Board for Medical Electronics Product Description
Layer:12 layerFinished Board thickness:1.6MMBoard material:FR-4Brand:KBTg aility:140 Finished Copper thickness:1 ozSurface treatment: Enigsolder mask Colour:GreenMin hole size:0.3mm We provide professional PCB manufacturing service. It will be our great pleasure to discuss with you about your PCB needs and requirements. Customer Satisfaction is Always Our First Priority!1.Products Application 2. Market Distribution 3.Technical Capabilities

Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm
Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		8:1
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%

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